静电卡盘集成设备
SeaTols ® Handit ® 手持静电吸附装置为超薄晶圆抓取及分拣而设计，采用点接触吸附结构，可最大限度的降低与超薄晶圆的接触面积，实现轻柔洁净吸附。手持静电吸附装置自带储能装置，满电状态下可连续运行6小时，可通过本体面板按键调节吸附电压、控制通断。此外，本体上LCD屏幕将实时反馈设置电压、吸附状态、错误报警及诊断等功能，可通过整个晶圆加工链实现安全的数据采集。
SeaTols ® Handit ® The Handheld electrostatic adsorption device is specially designed for grasping and sorting ultra-thin wafers. It adopts point contact adsorption structure, which can minimize the contact area with ultra-thin wafers and realize soft and clean adsorption. The handheld electrostatic adsorption device has its own energy storage device, which can operate continuously for 6 hours under full power. The adsorption voltage can be adjusted and the on-off can be controlled by pressing the keys on the body panel. In addition, the LCD screen on the body will feed back the functions of setting voltage, adsorption status, error alarm and diagnosis in real time, which can realize safe data acquisition through the whole wafer processing chain.
特征 | Features
均匀吸附 | 轻柔吸附 | 体积小 | 安全便携
Uniform Adsorption | Gentle Adsorption | Small Volume | Safe and Portable
运用 | Applications
薄片抓取 | 工艺开发 | 设备设计
Thin Grab | Etch | Process Development | Equipment Design
设计及制造 | Design and Manufacture
优化电极组结构及高低压正弦波叠加效应实现静电卡盘更多材质及结构物品轻柔、洁净吸附。
Optimize the structure of electrode group and the superposition effect of high and low voltage sine wave to realize the soft and clean adsorption of more materials and structural items of electrostatic chuck.
核心技术 | Core Technology
SeaTols ® Handit ® 是双极性便携手持静电吸附装置，用于抓取移载易碎、超薄基板，如薄晶圆、玻璃、金属箔等导导体与非导体薄片材料。通过电极组结构及高低压正弦波叠加效应的优化，Handit ® 对基材吸附力均匀，不会出现局部受力现象，能有效的保护薄基材的无损移载。Handit ® 结构设计符合人体工程学，操作员可以单手操作，吸附头可自由调整角度，以最合理的角度实现对薄基材的抓取。
SeaTols ® Handit ® It is a bipolar portable handheld electrostatic adsorption device, which is used to grasp and transfer fragile and ultra-thin substrates, such as thin wafers, glass, metal foil and other conductive and non-conductive sheet materials. Through the optimization of electrode group structure and high and low voltage sine wave superposition effect, handIt ® The adsorption force on the substrate is uniform, and there will be no local stress phenomenon, which can effectively protect the nondestructive transfer of thin substrate. Handit ® The structural design conforms to ergonomics, the operator can operate with one hand, and the adsorption head can freely adjust the angle to grasp the thin substrate at the most reasonable angle.
Further Product Information
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海拓创新公司通过优化电极组结构及高低压正弦波叠加效应改善静电吸附力的吸附适应性，实现对更多材质（导体、半导体、绝缘体）及结构（易碎、轻柔、透气）物品轻柔、洁净吸附。
SeaTools company improves the adsorption adaptability of electrostatic adsorption force by optimizing the electrode group structure and high and low voltage sine wave superposition effect, so as to realize the soft and clean adsorption of more materials (conductors, semiconductors, insulators) and structures (fragile, soft and breathable).
We cooperate to realize your unlimited creativity.
工作原理 | Principle
电介质库伦力学模型静电卡盘内部电极施加直流高压后，电介质表面会产生极化电荷，极化电荷形程静电场，静电场促使置于静电卡盘之上的晶片表面（与静电卡盘接触面）产生极化电荷，晶片表面与静电卡盘表面（有效电极部）对应区域范围聚集极性相反的电荷，异性电荷相吸，晶片被静电卡盘紧密吸附在其表面。特别注意的晶圆表面产生极化电荷还是自由电荷取决于晶片或镀膜的导电性能，类似硅晶圆等半导体晶片则产生自由电荷，蓝宝石等其他绝缘体晶片则产生极化电荷。
迥斯热背力学模型静电卡盘电介质层由纳米陶瓷粉和适量比例金属导体粉末混合烧结而成，电介质层电性特征介于半导体及绝缘体之间，在电极施加直流高压后，电介质表面在金属粉末的作用下会产生大量的自由电荷，自由电荷向晶片移动（仅针对半导体晶片），自由电荷使半导体晶片自由电荷总量增加。在极化电场的作用下，半导体晶片表面自由电荷与静电卡盘表面（有效电极部）对应区域范围聚集极性相反的电荷，异性电荷相吸，半导体晶片被静电卡盘紧密吸附在其表面；另外，蓝宝石等其他绝缘体晶片，晶片表面电荷总量保持不变，由极化电荷的作用完成吸附作业。
Dielectric Coulomb mechanics model After the internal electrodes of the electrostatic chuck are applied with DC high voltage, the surface of the dielectric will generate polarized charges, which form an electrostatic field. The electrostatic field promotes the surface of the wafer placed on the electrostatic chuck (the contact surface with the electrostatic chuck). ) Polarized charges are generated. Charges with opposite polarities are gathered on the surface of the wafer and the surface of the electrostatic chuck (effective electrode). Charges of opposite sex are attracted to each other, and the wafer is closely adsorbed on the surface by the electrostatic chuck. Pay special attention to whether polarized charges or free charges are generated on the wafer surface depends on the conductivity of the wafer or coating. Semiconductor wafers such as silicon wafers generate free charges, and other insulator wafers such as sapphire generate polarized charges.
The dielectric layer of the electrostatic chuck is made of nano-ceramic powder and a suitable proportion of metal conductor powder. The electrical characteristics of the dielectric layer are between semiconductors and insulators. After the electrodes are applied with DC high voltage, the dielectric layer of the electrostatic chuck is mixed and sintered. The surface will generate a large amount of free charge under the action of the metal powder, and the free charge will move to the wafer (only for semiconductor wafers), and the free charge will increase the total amount of free charge on the semiconductor wafer. Under the action of the polarization electric field, the free charge on the surface of the semiconductor wafer and the corresponding area on the surface of the electrostatic chuck (effective electrode) gather charges of opposite polarity, and the charges of opposite sex are attracted to each other, and the semiconductor wafer is tightly adsorbed on its surface by the electrostatic chuck; In addition, for other insulator wafers such as sapphire, the total surface charge of the wafer remains unchanged, and the adsorption operation is completed by the action of polarization charges.
